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H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 1 of 12 version# 1. 1 feature: - high data rate, 1mhz typ. (nrz) - microprocessor compatible drive - free from latch up and oscillation throughout voltage and temperature ranges - wide supply voltage capability, compatible with all popular logic systems - high isolation voltage bet we en input and output (viso = 5 3 0 0 v rms) - logic compatible output sinks 16ma at 0.4v max. - guaranteed on/off threshold hysteresis - current transfer ration (ctr: 50~600% at i f = 5ma, v ce = 5v) (ctr: 40~320% at i f = 10ma, v ce = 5v) - compact dual - in - line pa ckage - available packaged in tube or tape and reel - conventional black housing package certification & compliance: - pb free and rohs compliant - ul approved (e338132) - c ul approved (e338132) schematic:
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 2 of 12 version# 1. 1 dimension: (dot location indicates pin 1) 6 - pin dip (standard) : wide lead bend (option w): all dimensions are in mm tolerance = +/ - 0 .1mm
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 3 of 12 version# 1. 1 smd lead bend (option s): all dimensions are in mm tolerance = +/ - 0.1mm
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 4 of 12 version# 1. 1 absolute maximum rating : symbol parameter rating units H11L1 h11l2 h11l3 t stg storage temperature - 5 5 ~ +150 o c t opr operating temperature - 40 ~ + 85 o c t sol lead solder temperature 260 o c p tot total power dissipation 2 50 mw emitter i f continuous forward current 60 ma i p f peak forward current (300us pulse, 2% duty cycle 1.2 a v r reverse voltage 5 v p d power dissipation 1 0 0 mw detec tor v o v 45 allowed range 0 to 16 v v cc v 65 allowed range 3 to 16 v i o output current 50 ma p d collector power dissipation 150 mw derate above 25 o c 2 mw/ o c
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 5 of 12 version# 1. 1 electrical characteristic : (t=25 o c) emitter symbol characteristic device test condition range unit min typ max v f forward voltage H11L1 h11l2 h11l3 i f = 1 0ma - 1. 2 1.5 v i r reverse current H11L1 h11l2 h11l3 v r = 3 v - - 10 a c j c a pacitance H11L1 h11l2 h11l3 v = 0, f = 1k hz - - 100 pf detector symbol characteristic device test condition range unit min typ max v cc operation voltage range H11L1 h11l2 h11l3 3 - 15 v i cc(off) supply current H11L1 h11l2 h11l3 i f = 0ma, v cc =5 v - 3 ma i ch output current, high H11L1 h11l2 h11l3 i f = 0ma, v cc =v o = 15v - - 100 v isolation character is tics r iso isolation resistance H11L1 h11l2 h11l3 v i - o = 500vcd 10 11 - - ? v iso isolation voltage ioff<0.3ma, ac, 60s 5300 vrms
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 6 of 12 version# 1. 1 symbol characteristic device test condition range unit min typ max dc transfer characteristic i cc(on) supply current H11L1 h11l2 h11l3 i f = 10ma, v cc = 5v - 1.6 5 ma v ol output voltage .low H11L1 h11l2 h11l3 v cc = 5v, i f = i fon (max ), r l = 270? fon turn on threshold current 1 H11L1 v cc = 5v, r l = 270? f off turn off threshold current H11L1 h11l2 h11l3 v cc = 5v, r l = 270? fon /i foo hysteresis ratio H11L1 h11l2 h11l3 v cc = 5v, r l = 270? on turn on time H11L1 h11l2 h11l3 v cc = 5v, i f = i fon , r l = 270? rise time H11L1 h11l2 h11l3 v cc = 5v, i f = i fon , r l = 270? off turn off time H11L1 h11l2 h11l3 v cc = 5v, i f = i fon , r l = 270? fall time H11L1 h11l2 h11l3 v cc = 5v, i f = i fon , r l = 270? data rate H11L1 h11l2 h11l3 - 1 - mhz 1 . max. i f(on) is the maximum current required to trigger the output. for examples, a 1.6ma maximum trigger current would requir e the led to be driven at a current greater than 1.6ma to guarantee the device will turn on. a 10% guard band is recommended to account for degradation of the led over its lifetime. the maximum allo wable led drive current is 60ma
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 7 of 12 version# 1. 1 characteristic curves :
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 8 of 12 version# 1. 1 test circuit for response time : solder reflow temperature profile:
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 9 of 12 version# 1. 1 solder profile & footprint: recommended solder footprint for smd leadform units: mm tolerance: +/ - 0.1mm device marking: q = qt - brightek corporation x x xx = H11L1, h11l2, or h11l3 y = year ww = week
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 10 of 12 version# 1. 1 tape and reel packing specifications: tape dimensions: reel dimensions:
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 11 of 12 version# 1. 1 ordering information: part number orderable part number options description quantity per packing H11L1 H11L1 none standard 6 pin 6 0 pcs / tube H11L1w w wide lead bend (0.4 inch spacing) 6 0 pcs / tube H11L1 sta s smd lead form with tape and reel option 1000pcs / tube h11l2 h11l2 none standard 6 pin 6 0 pcs / tube h11l2w w wide lead bend (0.4 inch spacing) 6 0 pcs / tube h11l2 sta s smd lead form with tape and reel option 1000pcs / tube h 1 1l3 h11l3 none standard 6 pin 6 0 pcs / tube h11l3w w wide lead bend (0.4 inch spacing) 6 0 pcs / tube h11l3s ta s smd lead form with tape and reel option 1000pcs / tube
H11L1 h11l2 h11l3 6 - pin dip photocoupler schmitt trigg er product: H11L1 h11l2 h11l3 date: april 07 , 201 1 page 12 of 12 version# 1. 1 revision history: description: revision # revision date initia l release o f H11L1 h11l2 h11l3 1.0 4/2 2/2010 i n formation updates 1.1 04/07/2011 disclaimer qt - brightek reserves the right to make changes without further notice to any products herein to improve reliability, function or design. qt - brightek does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. life support policy qt - brighteks products are not authorized for use as critical components in life support devices or systems without the express written approval of qt - brightek. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the u ser. 2. a critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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